ʻO ka mākeke kiʻi wikiwiki wikiwiki e ulu i ka cagr o ka cagr o 22.1% mai 2023 a 20,0) Eia nō naʻe,ʻo ka Electromagnetic Interference (EMI) i kahi paʻakikī koʻikoʻi, me 68% o nā'ōnaehana e pili ana i ka mana o ka mana kiʻekiʻe. 2022). ʻO kēiaʻatikala e hoʻokaʻawale i nā hoʻolālā hana e kaua e hakakā ai em e hoʻomau i ka hanaʻana i ka hana.
1.ʻO ka hoʻomaopopoʻana i nā kumuwaiwai EMI i ka wikiwiki wikiwiki
1.1 Ke hoʻololiʻana i nā hana paʻakikī
Ua hanaʻo Gan Gan (Galluum Nitride) i nā mea kūʻai aku ma nā alapine he 1 mhz, e hana ana i ka hana o ka hana. Ua hōʻikeʻia kahi haʻawina 2024 Mit i hōʻikeʻia he 65% o EMI EMISSIES
•ʻO Mosfet / Igbt hoʻololi i nā mea lawe (42%)
•Induktor-Core Saturation (23%)
•ʻO nā pakala pcb paytitics (18%)
1.2 Radiated vs. i hana EMI
•Radiated EMI: Peaks ma 200-500 MHz Rear (FCC Class B Rula: ≤40 DBμ / M @ 3m)
•LaweʻiaEMI: koʻikoʻi i ka 150 khz-30 mhz band (Cispr (Cispr 32 Cisphing 32 mau kūlana: ≤60 DBμV)
2.ʻO ke kaʻina hana militation
2.1 Multi-Multer Shadering Archity
E hoʻouna ana kahi 3-papa i ka 40-60 db attenuation:
•ʻO ka paleʻana i ka paleʻana:ʻO nā beats ferrite ma luna o DC-DC Converter i waho (ho'ēmi i ka walaʻau e 15-20 db)
• Nā'āpana kiʻekiʻe:Copper-hoʻopihapiha i hoʻopihapiha i nā apo (blocks 85% o ke kahua kokoke-kahua kokoke loa)
• nā kikowaena kikowaena:Nā mea hao mu-metal me nā gaskets e hana ai (atteuation: 30 db @ 1 ghz)
2.2 nā mea hoʻohui hoʻohui hoʻohui
• Nā kānana likeʻole:3DD-kauoha i nā hoʻololi LC
• Nā papa koho maʻamau:NaNocryStalline cores me> 90% o ka hana ma keʻano he 100 ° C
• Ke hoʻololi neiʻo EMI Excellation:ʻO ka kānana e hoʻololiʻia ai ka manawa (e hōʻemi i nā helu helu helu ma ka 40%)
3. Hoʻolālā hoʻolālā hoʻolālā hoʻolālā
3.1ʻO PCB Passest hana maikaʻi loa
• Ke kaʻina hana koʻikoʻi:Mālama i ka 5 × trace trace ākea ākea ma waena o nā mana a me nā laina hōʻailona
•ʻO ka papa mokulele mokulele:ʻO nā papa inoa 4 me ka <2 mok-mindpedance (hōʻemi i ka bounce Bounce e 35%)
• ma ka stitching:0.5 mm pitch ma o nā hoʻonohonohoʻana i nā wahi kiʻekiʻe a puni nā wahi kiʻekiʻe-di / DT
3.2 Thernamal-Emi co-hoʻolālā
Hōʻikeʻo Thermal Simulations:
4. E hoʻomanawanui a ho'āʻo
4.1 Pre-Hoʻolālā Pre-hoʻokō i nā hana hoʻokolohua
• kokoke i ke kulaE hoʻomaopopo i nā hotspots me 1 mm spatial comput
•ʻO ka manawa hana-Douin e noʻonoʻo ana:Nele i nā kuhi hewaʻole i loko o 5% pololei
• Nā polokalamu EMC:Ua loaʻa iā REBSS HFSS SIMULLS i nā hopena lab i loko o ± 3 DB
4.2 Ponlock blonman
• FCC mahele 15 subpart b:Nā Mandates <48 DBμVV / Mdiated emissions (30-1000 mhz)
• CISP 32 # papa 3:Koi i ka 6 db haʻahaʻa haʻahaʻa ma mua o ka papa B ma ka papa o kaʻoihanaʻoihana
• MIL-STD-461G:ʻO nā SPETER-CHIMES SPECTS no nā'ōnaehana hoʻonohonoho i nā'ōnaehana koʻikoʻi
5
5.1 ATTA-WESTERS ONTERS
Hōʻike i nā metamatersal
•ʻO 97% ka mea e pono ai ma ka 2.45 GHZ
•0.5 mm mānoanoa me 40 db kaawale
5.2 kaʻenehana twipetital twipetital
Nā'ōnaehana SECEM eMia maoli:
•92% correlation ma waena o nā prototyps virtual a me nā hōʻike kino
•Hoʻemi i nā hana hoʻomohala e 60%
EMPOWEING KAʻI KĀNĀWAI ENGGING me kaʻike
Linpopower e like me ke alakaʻiʻana i ka mea hana e hana nei, e hoʻomaʻamaʻa mākou i nā'ōnaehana wikiwiki e hoʻopili ai i nā'ōnaehana cute-couchlessly i hōʻikeʻia ma kēiaʻatikala. Ua loaʻa nā ikaika o kā mākou papa inoa o kā mākou hana:
•Mai nā papa inoaʻo Multi-Multi-stixtectors i nā simulate e laweʻia ana, ua hōʻike mākou i nā hoʻolālā mil-stD-461g-indy-461g-indys
• Thermal-EMI Co-Engineering:ʻO Propetary Phase-E hoʻololi i nā'ōnaehana hoʻomaha hoʻomaha e mālama i ka <2 DB EMI VACATION ON -40 ° C a 85 ° C hana.
• Hoʻolālā hōʻoia:94% o kā mākou mea kūʻai aku e hoʻokō i ka FCC / CISPR i loko o ka ho'āʻo muaʻana, e hōʻemi ana i ka manawa manawa-i ka manawa 50%.
No ke aha e pili ai me mākou?
• nā hopena hopena-hope loa:Nā hana hoʻolālā i hoʻohanaʻia mai nā kumu 20 kw depot charrs i 350 kw camb-wikiwiki
• 24/7 kākoʻoʻepekema:EMI Diagnostics a me Firmware Optimization ma o ka nānāʻana o ka mamao
•ʻO nā hoʻonui hou-hōʻike-hōʻike:ʻO nā mea hou criphene meta
E kāhea i kā mākou huiʻenehanaNo kahi EMI manuahiaudit o kāu mau'ōnaehana i loaʻa a iʻole eʻimi i kā mākoupre-respoifoid Charging Modlele Portfolios. ^. E hana mākou i ka hanauna hou o nā mea i hanaʻoleʻia, kiʻekiʻe loa i nā hopena kūpono kiʻekiʻe.
Post Time: Feb-20-2025